Solder Design Commenting Keyhold Collies

Selective soldering can be achieved under an angle (tilt) as in wave soldering, or horizontally with different shaped nozzles and nozzle materials. All have different properties and can be applied to successfully soldering the most complex assemblies. In order to optimize production and soldering efficiency, assembly engineers should be involved in the Design for Assembly process. Knowledge of ...

Recommendations for the Design of Assemblies to be Soldered Selectively (Selective Miniwave Soldering) The following data is based on projects which already were realized. Required clearances etc., however, may differ depending on application.

Surface mount board layout is a critical portion of the total interface between the board and the package. With the design. The footprint for the semiconductor packages must correct pad geometry, the packages will self align when be the correct size to ensure proper solder connection subjected to a solder reflow process.

General This document describes general guidelines and attention points for PCB design regarding selective soldering. The guidelines can be applied for Select Wave and/or Multi Wave soldering process in both leaded and lead-free alloy.